Senior Die Bond Equipment & Process Engineer

Nexperia

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.
About The Role
We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines , and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.
What You Will Do:
Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
Develop, implement, and improve die attach processes for semiconductor devices.
Troubleshoot equipment and process issues to maintain high yield and reliability.
Collaborate with cross-functional teams to support new product introductions.
Analyze process and equipment data to identify trends and implement corrective actions.
Drive continuous improvement initiatives to enhance throughput, efficiency, and cost-effectiveness.
Mentor junior engineers and share best practices within the team.
Ensure compliance with safety, quality, and environmental standards.
Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and Process.
Internal and External audit.
Cost / MVA project and other related project for Equipment and Process.
Other activities assigned by superior.

What You Will Need:
Bachelor's degree in electrical/electronic engineering, mechanical engineering, materials science, or a related field.
Minimum 5 years of experience in die bond equipment and semiconductor process engineering.
Solid Hands-on experience in ASM/ADAT die bond equipment, including buyoff machines, and process optimization. Other Die Bond machine is a plus.
Strong understanding of semiconductor packaging, thermal, and mechanical considerations.
Proven problem-solving and analytical skills, with the ability to use data to drive decisions.
Knowledge of semiconductor quality standards, reliability testing, and process control.
Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
Excellent communication and collaboration skills.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Go to foundit.my

Vacancy posted 23 days ago

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