Staff Engineer, Packaging Engineering

Western Digital Capital

  • Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
  • Business Function: Packaging Engineering

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

  • Leads new SSD product development from concept design and qualification to mass production.
  • Generate innovative product concepts and transform them into tangible, market-ready products.
  • Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options.
  • Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.
  • Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time.
  • Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.
  • Lead new product from low volume to high volume production transition with yield and quality meeting goals.
  • Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
  • Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

Qualifications

  • Bachelor's degree with a minimum of 5 years of relevant experience, Master's degree with at least 2 years of experience, or PhD in Material Science, Mechanical Engineering, Computer Science, or other engineering disciplines.
  • Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
  • Self-motivated and self-directed.
  • Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
  • Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
  • Excellent communication skills, enabling collaboration with global functional teams.
  • Experience with programming languages such as Python or SQL is a plus.
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Vacancy posted 1 day ago

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