Staff Resident Engineer, Packaging

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pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

Job Summary:

The Packaging Resident Staff Engineer will perform technical oversight and audit, document, implement, monitor and improve processes related to pSemi products that are manufactured or processed at Unisem or UAT factories located in Ipoh or Gopeng, Malaysia.

This position will be responsible for, but not limited to, the following functions:

· NPI package development and assembly support (including wafer bumping)

· Package manufacturing technical oversight

· Facility technical and quality auditing

· Supplier corrective action management (technical)

· Day-to-day problem resolution (e.g. quality holds) at suppliers.

This role will work with pSemi engineers to transfer and align processes for consistent manufacturing, coordinate with NPI Packaging and Sustaining Engineering to establish and oversee new bumped die or plastic package assembly.They will also work together to ensure consistency in processing quality.The engineer will be responsible for the dispositioning of any discrepant material. He or she will specify, implement and monitor process control procedures, focus on improving production efficiencies/capacity, production yields and support the company objectives.This role will use proven problem-solving methodologies to provide technical support for quality processing and to meet production demands. This position establishes and implements operator processing specifications and improves manufacturing techniques, and production yields.

Roles & Responsibilities will include:

This position has responsibility for:

· Providing engineering support and coordinating package development with new product development teams and operations

· Analyzing, developing, and qualifying robust manufacturing processes for the improvement of yield, cost, quality, cycle time and capacity

· Directing and overseeing process characterization and development for pSemi products

· Developing and implementing process control techniques and procedures into manufacturing environments

· Developing, reporting and improving metrics for processes under your responsibility

· Ensuring monitoring and maintenance of process and process controls

· Overseeing failure analysis and problem resolution in the development process or production environment and providing engineering support to trouble shoot and resolve technical problems

· Overseeing the disposition of production discrepant material

· Measuring, analyzing and reporting incoming quality issues to the subcontractors, especially for product that comes from the San Diego facility

· Creating and maintaining related manufacturing process and quality documents

· Coordinating Process Change Notice (PCN) activities

· Conducting process optimization, FMEA, process flow diagrams, control plans and work instructions

Minimum Qualifications (Experience & Skills)

· Typically requires 8 years of experience in related field

· Knowledge of back-end semiconductor manufacturing processes and concepts

· Understanding the chip design and manufacturing process and interaction with packaging and assembly.

· Experience with package assembly process development

· Cross-functional team leadership

· Experience in conducting Technical or Quality Audit

· Excellent Project management skills and the ability to prioritize multiple projects

· Experience in 8-D problem solving methodology including Root Cause Analysis tools

· Proficiency in process characterization and Design of Experiments

· Excellent knowledge of statistical process control (SPC) including process capability studies

· Extensive proficiency creating written and pictorial documentation of manufacturing processes

· Ability to train manufacturing processes to production personnel

· Understanding of the semiconductor supply chain

· Understanding materials properties and interactions

· Understanding of RF packaging requirements

· Mastery of Word, Excel, and PowerPoint

· Experience driving packaging development efforts

· Read, interpret and comprehend complex written technical documents/publications

Preferred Qualifications

• Communicate clearly using written and verbal skills
• Well organized with meticulous attention to detail
• Maintain flexibility and adaptability to changing priorities and assignments, coping with rapidly changing information
• Work well under pressure while managing competing demands and tight deadlines
• Remain engaged, proactive and positive in tough circumstances, owning the processes are under your responsible

Education Requirements:

• Bachelor’s Degree in an engineering or related discipline

This job operates in a semiconductor manufacturing environment. This role routinely uses standard office equipment.

Physical Demands

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.

pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver’s license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including “protected veterans” under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.

Note: The Peregrine Semiconductor name, Peregrine Semiconductor logoand UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP andDuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: #J-18808-Ljbffr