Die Attach Process Engineer - Semiconductor Packaging
Nexperia
Nexperia in Malaysia is seeking a DACA Engineer (Die Attach Process Engineer) to develop, optimize, and sustain die attach manufacturing processes, driving high product quality and production efficiency.
The role collaborates with cross-functional teams to resolve technical issues, support new product introductions, and ensure stable production performance. Candidates typically have 5–8 years in semiconductor assembly, with Die Attach/DACA experience preferred.
#J-18808-LjbffrVacancy posted 2 days ago
Similar jobs that could be interesting for youBased on the Die Attach Process Engineer - Semiconductor Packaging in Seremban vacancy
- ...Nexperia is a world-class company in semiconductor development and in-house... ...Job Summary Support stable Die Attach manufacturing by maintaining process capability, improving yield and... ...Update work instructions. Support engineering evaluations. Analyze SPC trends...
Nexperia
Seremban2 days ago - ...Nexperia is a world-class company in semiconductor development and in-house production. A proven global player... ...energetic environment. Job Summary Lead the Process Engineering team responsible for sustaining Die Attach manufacturing processes to achieve world-class...
Nexperia
Seremban21 days ago - ...Nexperia is a world-class company in semiconductor development and in-house... .... Equipment Sustaining Engineer Job Summary Responsible for sustaining Die Attach production equipment to ensure... ...Paralympic Games. Our recruitment process is inclusive and accessible to...
Nexperia
Seremban21 days ago - ...world-class company in semiconductor development and in-house... ...to-end ownership of both process and equipment performance for Die Bond and Wire Bond stations... ...assembly line. The engineer plays a critical role in... ...Own and sustain Die Attach and Wire Bond processes...
Nexperia
Seremban17 days ago - ...is a world-class company in semiconductor development and in-house production... ...energetic environment. Die Attach/ DACA Maintenance Manager... ...to Do Lead Maintenance Engineers and Technicians. Develop... ...Paralympic Games. Our recruitment process is inclusive and accessible...
Nexperia
Seremban20 days ago - ...SwiftCruit is seeking a Process Sustaining Manager in Seremban, Malaysia... ...This role leads the Process Engineering team to maintain high... ...and productivity within the Die Attach processes. The ideal candidate has 8–10 years of semiconductor experience, ideally in leadership...
SwiftCruit
Seremban2 days ago - ...As a Die / Clip Attach Technical Expert, you will be responsible... ...technical solutions across semiconductor manufacturing processes, including Pre‑Assembly,... ...with factory and package R&D roadmaps; evaluate and... ...production, quality, and engineering teams. Industry & Market...
Nexperia
Seremban12 hours ago - ...Seremban, Malaysia is seeking a Process Sustaining Manager to lead its Process Engineering team. You will be responsible... ..., quality, and productivity in Die Attach manufacturing processes. The... ...Engineering and 8–10 years of semiconductor assembly experience. Strong knowledge...
Nexperia
Seremban2 days ago - ...Nexperia in Seremban, Malaysia is looking for a Die / Clip Attach Technical Expert to enhance manufacturing processes in semiconductor production. You will define equipment... ...The ideal candidate holds a degree in engineering, possesses over 10 years of experience in...
Nexperia
Seremban12 hours ago - ...maintenance organization, maximizing equipment uptime and manufacturing productivity in Die Attach production. The ideal candidate will have over 10 years of experience in semiconductor equipment and 5 years of leadership experience. This role involves developing...
Nexperia
Seremban2 days ago - ...dedicated individual to support Die Attach manufacturing. The role involves monitoring process performance and improving yield while reducing defects in a semiconductor environment. The ideal... ...should hold a Bachelor's Degree in Engineering and have 1–5 years of relevant...
Nexperia
Seremban2 days ago - ...Nexperia in Malaysia is seeking an experienced Process Engineer to sustain and improve manufacturing processes and equipment performance in the pre-assembly environment. You will help meet quality, yield, productivity and reliability targets across production lines....
Nexperia
Seremban1 day ago - ...is a world-class company in semiconductor development and in-house production... .... Ready to launch your engineering career We're growing... ...of some of the most critical processes in advanced semiconductor manufacturing... ...with state-of-the-art Die Bond and Wire Bond equipment...
Nexperia
Seremban17 days ago - ...Nexperia Malaysia is seeking a BE Process Engineering Engineer to develop new or modified process formulations, define equipment requirements, and review processing techniques for semiconductor manufacturing. You will lead improvement projects, manage LOH actions, conduct...
Nexperia
Seremban3 days ago - ...Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial... ...environment. POSITION OVERVIEW: In this role as a BE Process Engineering Engineer, develops new or modified process formulations,...
Nexperia
Seremban5 days ago - ...Nexperia is seeking an Equipment Sustaining Engineer in Seremban, Malaysia, responsible for maintaining Die Attach production equipment. The ideal candidate will... ...in Engineering and 3–5 years of experience in semiconductor equipment, along with a solid understanding of...
Nexperia
Seremban2 days ago - ...Nexperia is a world-class company in semiconductor development and in-house production. A proven... ...sustaining and improving manufacturing processes and equipment performance to achieve... ...Need to Have Bachelor's Degree in Engineering or related field. Minimum 3 years of...
Nexperia
Seremban7 days ago - ...Nexperia is a world-class company in semiconductor development and in-house production.... ...and energetic environment. DACA Engineer (Die Attach Process Engineer) The DACA Engineer is responsible... ...optimization, and supporting new package qualifications. Scope of Daily...
Nexperia
Seremban8 days ago - ...The Principal Process Engineer is a senior technical leader within the Malaysia... ...critical to successful die assembly, test, and long‑... ...improvement across the end‑to‑end semiconductor manufacturing flow.... ...fabrication, back‑end assembly and packaging, final electrical testing,...
onsemi
Seremban5 days ago - ...Position Overview Nexperia is a leading semiconductor company. This role is a Package Architect within a European R&D team, collaborating globally with... ...Chemistry, Physics, Materials Technology, Mechanical Engineering or similar. Strong leadership skills and proactive...
Nexperia
Seremban3 days ago - ...Nexperia in Malaysia is looking for an engineer responsible for the Die Bond and Wire Bond processes in a semiconductor assembly line. You will own process and equipment performance, and ensure high equipment uptime and quality in a high-volume manufacturing environment...
Nexperia
Seremban5 days ago - ...SwiftCruit is seeking an Engineer II in Seremban, Malaysia, responsible for the Die Attach and Wire Bond processes in a semiconductor assembly line. You will ensure high equipment uptime and quality excellence while driving continuous improvements. Qualifications include...
SwiftCruit
Seremban5 days ago - ...Nexperia in Malaysia seeks a Senior Manufacturing Quality Engineer to maintain and improve semiconductor quality throughout manufacturing. You will work with R&D, Production, Process Engineering, and Customer Service to ensure compliance with internal and external requirements...
Nexperia
Seremban2 days ago - ...Nexperia is seeking a Senior Failure Analysis Engineer in Seremban, Malaysia. In this role, you will identify root causes of semiconductor device failures through comprehensive failure analysis at wafer, package, and die levels. Your responsibilities include performing...
Nexperia
Seremban5 days ago - ...Nexperia is seeking an engineer responsible for end-to-end ownership of process and equipment performance in Die Bond and Wire Bond stations. This position requires strong... ...and 5-7 years of hands-on experience in semiconductor manufacturing. Responsibilities include managing...
Nexperia
Seremban1 day ago - ...onsemi is seeking a Process Engineer to join their Central Engineering team in Seremban, Malaysia. This full-time role involves developing... ...include a BS degree in Engineering, experience in semiconductor processing, and strong skills in data analysis and communication...
onsemi
Seremban2 days ago - ...Onsemi is seeking a PSG Power Products & Test Development Engineer in Malaysia to join a cross-functional team. You will collaborate with product engineering and manufacturing test teams to enable new product development and seamless transfer to mass production across...
Onsemi
Seremban5 days ago - ...and implement cost-saving measures through process automation and simplification. Qualifications... ...: 1. Degree in Electrical & Electronic Engineering (Microelectronics). 2. Minimum 2 years working experience in semiconductor / wafer fabrication. About Us onsemi...
onsemi
Seremban5 days ago - A leading semiconductor company is seeking a Principal Product Engineer focused on High Power Modules for their New Product Development division. The ideal candidate will have over 10 years of experience in semiconductor product engineering and specialized expertise in...
Onsemi
Seremban4 days ago - ...Nexperia is seeking a Principal Test Engineer to drive evaluation, development, and deployment of advanced semiconductor test technologies across its global manufacturing network. You will act as SME, benchmark industry best practices, and lead strategic initiatives to...
Nexperia
Seremban3 days ago
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Die Attach Process Engineer - Semiconductor Packaging. Be the first to apply!
