Die Attach Process Engineer - Semiconductor Packaging
Nexperia
Nexperia in Malaysia is seeking a DACA Engineer (Die Attach Process Engineer) to develop, optimize, and sustain die attach manufacturing processes, driving high product quality and production efficiency.
The role collaborates with cross-functional teams to resolve technical issues, support new product introductions, and ensure stable production performance. Candidates typically have 5–8 years in semiconductor assembly, with Die Attach/DACA experience preferred.
#J-18808-LjbffrVacancy posted more than 2 months ago
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