Senior Wirebond Process Development Engineer (Assembly)

About Our Client

Our client is a renowned global leader in semiconductor design and manufacturing, specialising in analogue ICs and embedded processors. With a dedication to innovation, our client leverages the expertise of top-tier talent to shape the future of technology worldwide. Serving approximately 100,000 customers, they are committed to pioneering advancements that drive transformative change today and tomorrow. Their initiatives span from sustainable semiconductor manufacturing practices and employee welfare to community engagement and the nurturing of exceptional talent.

Job Description

• Innovate and implement enhanced manufacturing methods, procedures, and processes to boost efficiencies, yields, machine operations, and product quality.
• Develop and optimize automated wire bond programs, focusing on wedge bonding, to enhance manufacturing processes.
• Provide specialised support for wire bond processes related to customer deliverables, particularly in wedge bonding.
• Document detailed wire bond processes in specifications and work instructions.
• Specify appropriate wire bond materials (such as wire types and capillary part numbers) for specific applications.
• Establish statistical monitoring methods to support and maintain developed wire bond processes.
• Lead and execute projects to improve efficiency, reduce costs, enhance quality, support new product launches, and drive process improvements.
• Identify and address systematic issues in processes or equipment, continually communicating findings to engineering teams.
• Assist in the start up of equipment and processes during manufacturing ramp-up, conducting process experiments as needed.
• Participate in data analysis and contribute to resolving manufacturing problems effectively.

The Successful Applicant

• Minimum of 5 years of relevant experience in semiconductor manufacturing.
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
• Strong proficiency in statistical process control, engineering change control, and process release strategies.
• Expertise in wire bonding processes and the development of Plated Copper Coating (PCC), Copper Wire, and Gold Wire.
• Familiarity with quick-turn parameter adjustments is advantageous.
• Knowledge of the KNS platform (Maxum, Connx, Elite) is a plus.
• Experience in defining Design of Experiments (DOE) and conducting wire bond process characterisation and optimisation.
• Proven ability to solve complex problems under aggressive time-lines.
• Leadership skills to guide teams of new and senior engineers in developing Long Range Plans, focusing on Quality, Cost, Productivity, MOOI (Material, Overhead, Operating Costs, Inventory), Automation, and other areas.
• Capable of working independently and effectively prioritising engineering activities based on manufacturing requirements.
• Proactive and goal-oriented individual with a strong sense of urgency.
• Exceptional verbal and written communication skills.
• Collaborative team player with the ability to effectively work with individuals across various functions.
• Excellent time management abilities ensuring timely project completion.
• Demonstrated capacity to cultivate strong and influential relationships.
• Adaptability to thrive in fast-paced and dynamic environments.
• Initiative-driven with a proven track record of achieving results.
• Capable of excelling in a high-pressure work environment.

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