Principal Engineer Yield and Product Engineering
Infineon Technologies
Your Role Key responsibilities in your new role
- Work with IC design and test teams to create and review test plans,including providing recommendations for DFT & DFQ, test & debug visibility, manufacturability plan etc
- Bench-level testing, characterization, and debug of full ICs and IC sub-systems
- Work with manufacturing and process engineering team to develop,characterize new assembly processes
- 360deg characterization: ensure test coverage and cross-domain-correlations
- ATE to bench correlation and establishment of ATE production test limits
- Prepare wafer-split-plan for process window characterization/DOE
- Limit and guard band definition for all test-program versions
- Development of Qualification Stress Hardware
- Test-Program development support
- Test-Program transfer support – Production/RPT
- ATE test-data analysis and interpretation
- Support failure analysis requests – ATE/bench/FA
- Implement productive quality measures: dPAT, SBA, OCAP, QA
- Provide Yield-roadmap for electrical testing
- Yield and Cpk analysis and reporting
- Continuous improvement for Yield and test-time
- Continuous improvement of data-analysis and reporting methods
- Disposition of Wafer sort and Final test
- Support and execute product qualification
- Support engineering team with NPI
- Analysis of RMA Customer returns and root cause analysis
- A Bachelor's degree in Electrical or Electronics Engineering (power electronics, semiconductor development) or a related discipline, with atleast 10 years of experience in a semiconductor company.
- Strong data analytical skills in the evaluation and characterization of power semiconductors
- Strong test development skills along with the ability to define hardware/software needs for debug
- Yield analysis and circuit debug experience with 6-sigma quality practices is an asset
- Experience working with a variety of technical projects that relateto product and test engineering, failure analysis, design, yield improvement
- Demonstrated experience with hands-on product characterization methodologies (planning, understanding of measurement techniques and use of lab equipment)
- Detailed understanding of semiconductor product life cycle from post silicon bring up, device characterization, qualification, pre-production support, release to volume production and product sustenance
- Proficient in at least one data analysis tool (JMP, Spotfire,scripting/ coding)
- Understanding of electronic circuits (schematics)
- Familiar with reliability, burn-in circuit design, data analysis,automation, cost reduction, and customer support
- Experience with GaN or other compound semiconductor devices strongly desired
- Understanding of statistical analysis techniques (SPC, CPK, CPU, CPL,etc)
- Familiar with ATE testing concepts
- Familiar with product knowledge (design and application basics)
- Understanding of Failure analysis flow and methods
- Ability to write concise engineering reports
- Strong knowledge ofdevice physics
- Familiarity with industry standard reliability testing and failure analysis
- Electrical and Thermal characterization
- Familiarity with wafer fabrication and packaging process
- Experience in probe and final test operation
- Experience with automating data analysis
- Demonstrated ability to perform moderately defined tasks relating toall phases of a product life cycle
- Demonstrated ability to autonomously manage a myriad of demands and prioritize effectively
- Excellent written and verbal communication skills
- Maintains accountability for actions (ownership of work)
- Good knowledge sharing and presentation skills
Vacancy posted 17 days ago
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