Principal Package Design Engineer
Join Nexperia and connect your unique talents and passion to your goals for a fulfilling career with growth and reward. We are a global semiconductor manufacturer with a highly skilled and diverse workforce of over 15,000 employees from over 50 countries worldwide. Every electronic design in the world can be made complete with Nexperia products.
To meet the customer’s evolving needs, our engineers are dedicated to developing cutting-edge semiconductor solutions via advanced design tools and methodologies to create innovative products that deliver high performance, reliability, efficiency, and quality.
We are committed to providing a positive and supportive environment for our employees. We offer competitive compensation packages, health and wellness programs, on-the-job training, and career development opportunities, as well as promoting work-life balance by offering flexible work arrangements and various employee engagement initiatives.
About the role
What you will do
- Responsible for the new package design and continuous design improvement of various semiconductor packages, mainly in discrete package.
- Lead frame design for NPI projects that meet project functional requirements with excellence for manufacturing.
- Work with Package Architect on package design and responsible for technical assembly drawings, ensuring dimensioning and tolerances are based on assembly capability, package technology, and lead frame fabrication design rules, aligning with industrial and internal standards with best practices.
- Identify cost down opportunities and drive projects to enhance package competitiveness.
- Application of statistical analysis tools, failure analysis, and problem-solving techniques for sound solutions.
- Preparation of Technical Papers and IP Generation.
What you will need
- Master/Bachelor’s Degree in Mechanical/Electronic/Manufacturing Engineering or related discipline.
- 5 years working experience in Lead frame/Semiconductor packaging design or other relevant fields.
- Knowledge of Semiconductor Packaging and Assembly preferred.
- Excellent verbal and written communication skills in bilingual.
- Capability to adapt to the company’s changing needs and priorities and be a self-motivated team player.
- A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA, etc.) is required.
- Proficient in using AutoCAD & SolidWorks is essential.
- Experience in dealing with China counterparts.
Why work for us?
At Nexperia, we offer a comprehensive compensation and benefits package tailored to your individual needs, including:
- Competitive compensation and benefits: we offer competitive salaries, bonuses, and benefits packages to our employees, including health insurance, retirement plans, and paid time off.
- Career development opportunities: We provide various career development opportunities, including training programs, mentoring, and leadership development programs, to help employees enhance their skills and advance their careers.
- Work-life balance: We recognize the importance of work-life balance and offer flexible work arrangements, including work-from-home options, to our employees in Malaysia.
- Employee engagement initiatives: We have various employee engagement initiatives, such as team-building activities, social events, and employee recognition programs, to promote a positive work culture and enhance employee morale.
- Health and wellness programs: We promote employee health and wellness through various on-site programs to help employees maintain a healthy work-life balance from the perspective of physical and mental well-being.
About The Team
There are three functional teams in Central functions of Package R&D. One of them is Package Design and Modelling. The Design team takes care of package Design in new development and oversees all related Design drawing documents.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
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