Die Bond Specialist Lead/Staff Engineer (Da Vinci)

Full-time

Confidential

OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.

YOUR ROLE

  • Lead a group of process (Die bond, Panel release and transfer, Sputtering, DLC, Carrier plate preparation)
  • Monitor, analyze and drive yield performance. Work out with process owner on yield improvement
  • Manage carrier plate preparation process to ensure the carrier plate quality and circulation management well done.
  • Work as a team between Operation/ Equipment/ Quality to resolve production, quality issue and reduce production line disruption.
  • Perform FMEA, risk assessment of process changes with proper change management process.
  • Manage recipe and procedural control. Familiar with Control plan, OCAP, WI & FMEA.
  • Ensure robustness of processes with SPC and other process control tools.
  • Initiate and support excursion prevention, cost reduction and quality improvement projects.
  • To provide technical support when there are critical quality concerns

Your Skills & Experiences

  • Masters/Bachelor's Degree in Engineering (Mechanical / Mechatronics / Manufacturing/ Material Science / Chemical) or equivalent.
  • 5-10 years working experiences (specialist in die bond preferrable)
  • Good communication skill and equipped with strong analytical skills.
  • Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.
  • Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
  • Able to lead and coach engineer and tech.
  • Practice high performance behavior and together work as Team in executing projects & strive for excellent.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!

To discover more, visit st.com/careers ocap, Fmea, Spc, Process Mapping, sputtering, 8D, Dmaic, Wi, DLC
Vacancy posted 5 days ago

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