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- ...Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (...
- ...requirements. The role spans verifying package documentation, coordinating with internal teams, and collaborating closely with offshore assembly and manufacturing partners. Manufacturing Sustaining Engineers support products in back-end manufacturing, validate manufacturing...
- ...Electrical, Mechanical, Materials, Chemical engineering or related discipline. ~Minimum 2 years’ experience in semiconductor back-end assembly — volume production experience required. ~Strong practical knowledge of wirebond processes, leadframe design considerations,...
- ...Electrical or Materials Engineering. ~5-12 years of relevant experience in package development emphasizing Power package design and assembly process development. ~ Understanding of semiconductor power device package assembly processes, materials, and technology....