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- About the Role We are SSP The Food Travel Experts. We are experts in creating and running food outlets in locations where people are on the move. Whether it’s jetting off somewhere more exotic, getting on a train or stopping off at a motorway service area, we will...
- ...Job Details: Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative. The...
- ...investigation, disposition and improvement. Your Role Key responsibilities in your new role Yield improvement activities for Die Attach process. Sustain and achieve stability index for package under responsibility. Support production on daily issues...
Infineon Technologies
Malacca City, Malacca4 days ago - Conduct die attach process development for new products, including parameter optimization and process validation Development of innovative processes and process characterization methodologies for existing and new technologies. Your Role Key responsibilities in your...
Infineon Technologies
Malacca City, Malacca2 days ago - ...12 years working experience in semiconductor industry or others relevant industry. Strong hands-on experience and skills in Die Attach processes (flipchip, glue, DAF, sintering and reflow). Mechanical engineering, tooling design and reflow know how. Statistical...
Infineon Technologies
Malacca City, Malacca7 days ago - ...greener, in a responsible and sustainable way. Our technology starts with you. YOUR ROLE To develop and to industrialize new die attach process & material (Soft Solder, Die Attach Glue, Die Attach Film) for new lead frame packages, to meet the yield and quality...
STMicroelectronics
Muar, Johor11 days ago - ...Job Description Primary Duties & Responsibilities Responsible for DR8 Gen1.5 Support DR8 Gen1.5 Die attach process. To assist the process engineer in achieving assembly target. To maintain and qualify equipment, tools/ fixtures for production used. Perform...
Coherent Corp.
Ipoh13 days ago - ...Job Description JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products...
Coherent Corp.
Ipoh13 days ago - ...at least SKM level 3 certificate or Diploma qualification Min 2 - 3 years of experience in equipment maintenance especially Die Attach/Wire Bond related equipment. Min 2 - 3 years of experience in Back End manufacturing environment. Mechanical, sensors and eletrical...
Ams Osram
Bayan Lepas, Pulau Pinang3 days ago - A global semiconductor company in Johor, Malaysia is seeking a Material Engineering Manager to lead the sourcing of DA materials and Mold compounds. The ideal candidate will hold a Bachelor's or Master's degree in Engineering and have a minimum of 5 years of experience ...
ST
Muar, Johor3 days ago - A leading semiconductor company in Kulim, Malaysia, is seeking a Process and Equipment Module Engineer to manage high-volume manufacturing equipment. The role involves conducting tests, implementing improvements, and ensuring safety and quality standards. Candidates need...
Intel Corporation
Kulim, Kedah15 hours ago - # **Welcome!**## .Direct Lid/Stiffener Attach Packaging Module Development Engineer page is loaded## Direct Lid/Stiffener Attach Packaging Module Development Engineerlocations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR0281170# **Job...
Intel Corporation
Kulim, Kedah15 hours ago - A leading semiconductor company in Penang seeks a knowledgeable engineer to develop and optimize die attach and wire bond processes for new product development. The ideal candidate must have a degree in Engineering and several years of relevant experience in the semiconductor...
Ams Osram
Bayan Lepas, Pulau Pinang3 days ago - A leading technology company in Malaysia seeks an equipment maintenance specialist with experience in Die Attach/Wire Bond related equipment. The candidate will maintain machinery, perform tool changes, and support production in a Back End manufacturing environment. A...
Ams Osram
Bayan Lepas, Pulau Pinang3 days ago - ...Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent. ~2-3 years in semiconductor field. ~2-3 years in Die Attach and Wire Bond processes. ~ Process egnineering knowledge in semiconductors or LED manufacturing processes. ~ Knowledge in...
Ams Osram
Bayan Lepas, Pulau Pinang3 days ago - ...network device support Others: Fluent in English; strong documentation and user support skills. Chinese is an added advantage. Interested candidates may apply and attach their Curriculum Vitaebefore 28 March 2026 . Required Experience: Unclear Seniority...
- ...of incoming and outgoing shipments. Pack stock for delivery, seal, and tag cartons. Ensure correct shipping information is attached and move completed orders to the shipping area. Keep shelves fully stocked, tidy, and accurately labelled. Return unwanted items...
- ...product roadmap, value proposition, and regional business strategy. Support partners in building strong SketchUp pipelines, improving attach rates, and expanding into new industry segments. Participate in marketing initiatives, industry events, trade shows, and...
Tec D
Petaling Jaya5 hours agonew - ...leadership capabilities in a high-volume manufacturing environment What Youll Do: Oversee daily assembly operations including die attach wire bond molding plating and Trim & Form. Execute production plans to meet output cycle time and delivery targets. Monitor...
- ...English and Bahasa Melayu. 4. Flexibility energetic eager to tackle new projects & ideas. Additional Information : Please attach you university internship letter and indicate your internship period. Ready to drive with Continental Take the first step and...
- ...field. ~2–5 years of experience in semiconductor device failure analysis. ~ Familiar with semiconductor assembly processes (die attach, wire bond, etc). ~ Strong analytical, troubleshooting, and report-writing skills. ~ Good communication and teamwork abilities....
- ...opportunity. Candidates that already graduated will not be considered. To be considered for this role, please apply via the link and attach your CV, cover letter and academic transcript to your application. Applications close Sunday, 29 March 2026 at 11:59 PM MYT...
- ...Diploma of Engineering preferably majoring in Mechatronics or Mechanical or Electrical. Preferable for those experience in die attached machines and wire-bonders will be an added advantage. Willing to work on 12-hours shift independently and able to solve basic technical...
- ...Experience mentoring engineers and driving engineering best practices . Additional Information What to Do Next: Please attach your resume including links to your Github and website where applicable. If you want to show your super powers in other ways –...
- ...Sciences. Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes. Fully understand the process / package capabilities limitations and quality / reliability requirements of PQFNs/QFNs/...
- ...agreed procedures. Treasury ~ Ensure that payment requisition (for credit note / refund to customer) is raised correctly and attached with original invoices and claim form which has been properly matched with the supporting documents before submitting for payment....
- ...take the initiative and drive for results Ability to work in fast pace environment Competent in the assembly processes of die attach and wire bonding molded devices knowledge with KNS and ASM Platforms will be an added advantage. Competent in using statistical...
- ...documentation. Don't miss this opportunity to join a dynamic team and make your mark in the financing industry. APPLY NOW - Attach your resume today to secure your spot in our next interview cycle. Take the first step toward an exciting career with a fast...
- ...immediate right to work locally and no relocation needed will be prioritized When applying, please submit a full resume and attach your appraisal reports for the last two years. Your local internal application policy should also be followed. For internal applicants...
- ...Description Renesas is seeking a Senior / Staff/Sr Staff Test Engineer to support new product test development for our System Attach PMIC (SAP) business unit. Test development engineers are critical to Renesas' power management products. They interface directly...
