...In your new role you will:
Monitor PM activities, OEE & MTBA performance, quality and yield of assembly processes (mold, Xray, plasma and oven)
Trouble-shooting machine issues and drive for improvement activities in order to stabilize the machine performance...
...driven.
Experience and knowledge of semiconductor Assembly and Test e.g. DiePrep, Back Grind, Wafer Saw, Die Attach, Wire Bond, Mold, Plasma, Package Saw, AOI, Test etc including FMEA, FDC, APC, etc.
Experience in statistical analysis, machine learning, etc....